A low-cost packaged MMIC chip set for 5.8 GHz ISM band applications

Author

Pollman, M.D. ; Trantanella, C. ; Shifrin, M. ; Aparin, V. ; Upton, D.

Author_Institution

Hittite Microwave Corp., Woburn, MA, USA

fYear

1997

fDate

10-10 June 1997

Firstpage

33

Lastpage

36

Abstract

This paper describes a packaged MMIC chip set which was developed for low-cost communication equipment operating in the unlicensed 5.725 to 5.850 GHz Industrial, Scientific, and Medical (ISM) band (FCC rule 15.247). The GaAs MMIC chip set described consists of: (1) Transmit/Receive (T/R) switch, (2) low noise amplifier (LNA), (3) double-balanced downconverter mixer, (4) QPSK/BPSK modulator, and (5) variable-gain medium power amplifier. The MMIC designs are discussed and the measured performance of the packaged chip set is presented.

Keywords

MMIC amplifiers; MMIC frequency convertors; MMIC mixers; MMIC power amplifiers; modulators; phase shift keying; quadrature phase shift keying; spread spectrum communication; 5.725 to 5.850 GHz; FCC rule 15.247; ISM band applications; Industrial/Scientific/Medical band; QPSK/BPSK modulator; double-balanced downconverter mixer; low noise amplifier; low-cost communication equipment; packaged MMIC chip set; transmit/receive switch; variable-gain medium power amplifier; Communication equipment; Communication industry; Communication switching; FCC; Gallium arsenide; Low-noise amplifiers; MMICs; Packaging machines; Quadrature phase shift keying; Switches;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio Frequency Integrated Circuits (RFIC) Symposium, 1997., IEEE

Conference_Location

Denver, CO, USA

Print_ISBN

0-7803-4063-9

Type

conf

DOI

10.1109/RFIC.1997.598736

Filename

598736