DocumentCode
2799437
Title
Silicon VLSI technology-today and tomorrow
Author
Ning, T.H.
Author_Institution
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
1991
fDate
20-23 Oct. 1991
Firstpage
15
Lastpage
18
Abstract
The status of the leading-edge silicon VLSI products is reviewed. The future development trends of silicon VLSI technology are projected by examining scaling limitations and by exploring opportunities such as stacked TFT, HBT, SOI, and low-temperature system operation.<>
Keywords
VLSI; elemental semiconductors; integrated circuit technology; silicon; HBT; SOI; Si; VLSI technology; low-temperature system operation; scaling limitations; stacked TFT; BiCMOS integrated circuits; CMOS technology; Integrated circuit interconnections; Logic; Power dissipation; Random access memory; SRAM chips; Silicon; Thin film transistors; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1991. Technical Digest 1991., 13th Annual
Conference_Location
Monterey, CA, USA
Print_ISBN
0-7803-0196-X
Type
conf
DOI
10.1109/GAAS.1991.172622
Filename
172622
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