Title :
Silicon VLSI technology-today and tomorrow
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
The status of the leading-edge silicon VLSI products is reviewed. The future development trends of silicon VLSI technology are projected by examining scaling limitations and by exploring opportunities such as stacked TFT, HBT, SOI, and low-temperature system operation.<>
Keywords :
VLSI; elemental semiconductors; integrated circuit technology; silicon; HBT; SOI; Si; VLSI technology; low-temperature system operation; scaling limitations; stacked TFT; BiCMOS integrated circuits; CMOS technology; Integrated circuit interconnections; Logic; Power dissipation; Random access memory; SRAM chips; Silicon; Thin film transistors; Very large scale integration;
Conference_Titel :
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1991. Technical Digest 1991., 13th Annual
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-0196-X
DOI :
10.1109/GAAS.1991.172622
