• DocumentCode
    2799544
  • Title

    A 3D micromixer fabricated with dry film resist

  • Author

    Radadia, Adarsh D. ; Cao, Li ; Jeong, Hae-Kwon ; Shannon, Mark A. ; Masel, Richard I.

  • Author_Institution
    Univ. of Illinois at Urbana-Champaign, Champaign
  • fYear
    2007
  • fDate
    21-25 Jan. 2007
  • Firstpage
    361
  • Lastpage
    364
  • Abstract
    This paper presents a novel technique to build 3D microstructures using sequential lamination of dry film resist. Each layer is laminated, exposed, developed and flood exposed successively to form a 3D structure. The dry film resist method proves to be advantageous in terms of time and alignment accuracy. Dry film resist is limited by the resolution achieved via photopatterning. This paper also describes a fabrication process to achieve high resolution features with dry film resist. Processing parameters for achieving minimal sagging of suspended structures are discussed. Efficiency of micro-mixers enhance the ability of lab-on- chip devices. A 3D split-join-split type serial lamination micromixer that has been fabricated to demonstrate the feasibility of the dry film resist based process. This paper also shows feasibility to make woodpile structure with layer-by-layer processing of dry film resist.
  • Keywords
    laminations; microwave mixers; 3D micromixer fabrication; 3D split-join-split type serial lamination micromixer; dry film resist; layer-by-layer processing; photopatterning; sequential lamination; Aluminum; Fabrication; Lamination; Lithography; Microfluidics; Micromechanical devices; Resists; Sputter etching; Substrates; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2007. MEMS. IEEE 20th International Conference on
  • Conference_Location
    Hyogo
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-095-5
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2007.4433110
  • Filename
    4433110