DocumentCode
2799544
Title
A 3D micromixer fabricated with dry film resist
Author
Radadia, Adarsh D. ; Cao, Li ; Jeong, Hae-Kwon ; Shannon, Mark A. ; Masel, Richard I.
Author_Institution
Univ. of Illinois at Urbana-Champaign, Champaign
fYear
2007
fDate
21-25 Jan. 2007
Firstpage
361
Lastpage
364
Abstract
This paper presents a novel technique to build 3D microstructures using sequential lamination of dry film resist. Each layer is laminated, exposed, developed and flood exposed successively to form a 3D structure. The dry film resist method proves to be advantageous in terms of time and alignment accuracy. Dry film resist is limited by the resolution achieved via photopatterning. This paper also describes a fabrication process to achieve high resolution features with dry film resist. Processing parameters for achieving minimal sagging of suspended structures are discussed. Efficiency of micro-mixers enhance the ability of lab-on- chip devices. A 3D split-join-split type serial lamination micromixer that has been fabricated to demonstrate the feasibility of the dry film resist based process. This paper also shows feasibility to make woodpile structure with layer-by-layer processing of dry film resist.
Keywords
laminations; microwave mixers; 3D micromixer fabrication; 3D split-join-split type serial lamination micromixer; dry film resist; layer-by-layer processing; photopatterning; sequential lamination; Aluminum; Fabrication; Lamination; Lithography; Microfluidics; Micromechanical devices; Resists; Sputter etching; Substrates; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2007. MEMS. IEEE 20th International Conference on
Conference_Location
Hyogo
ISSN
1084-6999
Print_ISBN
978-1-4244-095-5
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2007.4433110
Filename
4433110
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