Title :
Embedded transmission line (ETL) MMIC for low-cost, high-density wireless communication applications
Author :
Hua-Quen Tserng ; Saunier, P. ; Ketterson, A. ; Witkowski, L. ; Jones, T.
Author_Institution :
Syst. Components Lab., Texas Instrum. Inc., Dallas, TX, USA
Abstract :
A new embedded transmission line (ETL) MMIC approach which allows flexibility in mixing different transmission line types (i.e., coplanar and striplines) for maximum MMIC (Monolithic Microwave Integrated Circuits) design flexibility and permits the elimination of back-side processing for low production cost is described. This ETL MMIC approach is an enabling technology allowing for low-cost, batch fabrication, and high-density integration of microwave and RF components (including silicon mixed signal products) for emerging wireless communication applications.
Keywords :
MMIC; integrated circuit design; mixed analogue-digital integrated circuits; mobile communication; strip lines; wireless LAN; IC design; MMIC; batch fabrication; coplanar transmission lines; embedded transmission line; high-density integration; high-density wireless communication application; mixed signal products; production cost; striplines; Coplanar transmission lines; Costs; Distributed parameter circuits; Integrated circuit technology; MMICs; Microwave integrated circuits; Monolithic integrated circuits; Production; Stripline; Transmission lines;
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 1997., IEEE
Conference_Location :
Denver, CO, USA
Print_ISBN :
0-7803-4063-9
DOI :
10.1109/RFIC.1997.598738
