DocumentCode :
2799667
Title :
Study of heat dissipation for HXD2 locomotive´s auxiliary converter
Author :
Xianjin, Huang ; Liwei, Zhang ; Hu, Sun ; Xiaojie, You ; Zheng, Trillion
Author_Institution :
Beijing Jiaotong Univ., Beijing, China
fYear :
2010
fDate :
12-16 Sept. 2010
Firstpage :
1666
Lastpage :
1671
Abstract :
Modern AC traction locomotives, are characteristic of miniaturization, increasing switching frequency and increasing packaging densities, require increased current handling capability of packaged devices in applications related to power conversion. These ever-increasing demands pushed the efficiency of silicon semiconductor power-device to the limit. The heat dissipation in the power system must be taken into account. The temperature field of a product can be picked up to optimize the design and improve the reliability by the technology of thermal analysis in the phase of design. This paper describes results of thermal simulations in the module of HXD2 auxiliary converter with air cooling system. Integrated Thermal Analysis was conducted using the Flotherm and Icepak computational fluid dynamics (CFD) software packages. Influence of air-cooling system parameters on temperature distribution in module was also investigated. The optimized arrangement of the 6 power modules proved the results of thermal simulation of the auxiliary block.
Keywords :
computational fluid dynamics; cooling; locomotives; power convertors; temperature distribution; traction; AC traction locomotives; air cooling system; computational fluid dynamics; current handling capability; heat dissipation; integrated thermal analysis; locomotive auxiliary converter; semiconductor power-device; temperature distribution; temperature field; Choppers; Computational fluid dynamics; Electronic packaging thermal management; Insulated gate bipolar transistors; Inverters; Temperature; Thermal analysis; CFD; auxiliary converter; heat dissipation; thermal analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Conversion Congress and Exposition (ECCE), 2010 IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
978-1-4244-5286-6
Electronic_ISBN :
978-1-4244-5287-3
Type :
conf
DOI :
10.1109/ECCE.2010.5618108
Filename :
5618108
Link To Document :
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