DocumentCode :
2799815
Title :
Multilevel Metal Using Submicron Copper Interconnects
Author :
Rogers, B. ; Bothra, S. ; Bobbio, S. ; Kellam, M.
Author_Institution :
MCNC Center for Microelectronics Research, NC
fYear :
1992
fDate :
1-3 Mar 1992
Firstpage :
38
Lastpage :
42
Keywords :
Capacitance; Copper; Current density; Delay effects; Electromigration; Etching; Geometry; Integrated circuit interconnections; Integrated circuit reliability; Ultra large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
System Theory, 1992. Proceedings. SSST/CSA 92. The 24th Southeastern Symposium on and The 3rd Annual Symposium on Communications, Signal Processing Expert Systems, and ASIC VLSI Design
ISSN :
0094-2898
Print_ISBN :
0-8186-2665-8
Type :
conf
DOI :
10.1109/SSST.1992.712179
Filename :
712179
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2799815
بازگشت