• DocumentCode
    2799815
  • Title

    Multilevel Metal Using Submicron Copper Interconnects

  • Author

    Rogers, B. ; Bothra, S. ; Bobbio, S. ; Kellam, M.

  • Author_Institution
    MCNC Center for Microelectronics Research, NC
  • fYear
    1992
  • fDate
    1-3 Mar 1992
  • Firstpage
    38
  • Lastpage
    42
  • Keywords
    Capacitance; Copper; Current density; Delay effects; Electromigration; Etching; Geometry; Integrated circuit interconnections; Integrated circuit reliability; Ultra large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    System Theory, 1992. Proceedings. SSST/CSA 92. The 24th Southeastern Symposium on and The 3rd Annual Symposium on Communications, Signal Processing Expert Systems, and ASIC VLSI Design
  • ISSN
    0094-2898
  • Print_ISBN
    0-8186-2665-8
  • Type

    conf

  • DOI
    10.1109/SSST.1992.712179
  • Filename
    712179
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2799815