DocumentCode
2799999
Title
Acoustic polarization for optimized implantable power transimittion
Author
Po-Jen Shih ; Wen-Pin Weng ; Wen-Pin Shih ; Pei-Zen Chang
Author_Institution
Nat. Taiwan Univ., Taipei
fYear
2007
fDate
21-25 Jan. 2007
Firstpage
879
Lastpage
882
Abstract
We present a fully-packaged acoustic power receiver which is implantable in the subcutaneous tissue to receive the acoustic energy generated from a compressive wave emitter on the skin. The implanted receiver is a piezoelectric acoustic transducer and is packaged by biocompatible cohesive gels. This specific package is soft enough to absorb the incident wave from the subcutaneous tissue. The receiver employs direct charging to convert the acoustic energy into the extractable electrical energy through piezoelectricity when exposed to the acoustic field. The effects of the scattering package shape and the stiffness ratio between the package and subcutaneous tissue are considered to design the receivers. The energy efficiency of the fabricated receiver is measured inside real streaky pork, which is used to simulate human subcutaneous tissue. The result indicates that the spherical package is more suitable than the cubic one when they are buried in the fatty layer. The maximum efficiency of the power transmission is found to be -40dB.
Keywords
acoustic transducers; biological tissues; biomedical transducers; electronics packaging; gels; piezoelectric transducers; power transmission; prosthetics; acoustic polarization; biocompatible cohesive gels; compressive wave emitter; energy efficiency; fully-packaged acoustic power receiver; implanted receiver; optimized implantable power transmission; piezoelectric acoustic transducer; piezoelectricity; scattering package shape; soft package; spherical package; stiffness ratio; subcutaneous tissue; Acoustic emission; Acoustic scattering; Acoustic transducers; Acoustic waves; Packaging; Piezoelectric polarization; Piezoelectricity; Power generation; Shape; Skin;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2007. MEMS. IEEE 20th International Conference on
Conference_Location
Hyogo
ISSN
1084-6999
Print_ISBN
978-1-4244-095-5
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2007.4433136
Filename
4433136
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