• DocumentCode
    2800222
  • Title

    A unified modeling of NBTI and hot carrier injection for MOSFET reliability

  • Author

    Kufluoglu, H. ; Alam, M.A.

  • Author_Institution
    Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • fYear
    2004
  • fDate
    24-27 Oct. 2004
  • Firstpage
    28
  • Lastpage
    29
  • Abstract
    A unified theory of negative bias temperature instability (NBTI) and hot carrier injection (HCI) induced interface trap generation is developed to simultaneously explain the time-exponents of both phenomena. Characteristic time-dependence of interface trap generation (/spl Delta/N/sub IT/ /spl sim/ t/sup n/) due to NBTI (/spl sim/t/sup 0.25/) and HCI (/spl sim/ t/sup 0.5/) degradation are shown. Our model not only agrees with the experimental exponents and provides insight into dynamic behavior of the degradation processes for planar MOSFETs, but also predicts possible reliability concerns for the future-generation of surround-gate device geometries. The unified R-D model described in this paper successfully captures, for the first time, the geometry-dependence of trap generation and unifies HCI and NBTI. Significant achievements are: (i) agreement with the experimental data; (ii) realistic lifetime projection; and (iii) predictions of higher degradation rate for future generation of surround gate devices.
  • Keywords
    MOSFET; charge injection; hot carriers; interface states; semiconductor device models; semiconductor device reliability; HCI degradation; HCI induced interface trap generation; MOSFET reliability; characteristic time-dependence; geometry-dependence; hot carrier injection; negative bias temperature instability; surround gate devices; Hot carriers; Interface phenomena; MOSFETs; Semiconductor device modeling; Semiconductor device reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computational Electronics, 2004. IWCE-10 2004. Abstracts. 10th International Workshop on
  • Conference_Location
    West Lafayette, IN, USA
  • Print_ISBN
    0-7803-8649-3
  • Type

    conf

  • DOI
    10.1109/IWCE.2004.1407302
  • Filename
    1407302