Evaluation of large area die attach using acoustic microscopy

The technique chosen at Caswell for the analysis of die-bonds is acoustic microscopy. This is a reflection rather than transmission based technique, and has been used successfully for the nondestructive analysis of die-bonds up to 15 mm square. In this presentation, comparisons will be made between acoustic microscopy and other die-attach evaluation techniques. Examples will be shown of the way in which acoustic microscopy is used for bond evaluation and other assembly related activities