DocumentCode :
280210
Title :
A CAD package for the prediction and reduction of radio-frequency interference from microprocessor based electronic equipment
Author :
Marvin, A.C. ; Tealby, J.M. ; Carr-Brion, T.J.F. ; Porter, S.J. ; Mann, S.M.
Author_Institution :
York Univ., UK
fYear :
1990
fDate :
33038
Firstpage :
42614
Lastpage :
42616
Abstract :
The authors describe the production of an EMC CAD package for use in the design of electronic computing equipment. The design of electronic equipment is split up into several separate areas such as circuit design, circuit layout, enclosure design, and thermal design. EMC considerations are taken into account at all stages in the design process
Keywords :
circuit layout CAD; electromagnetic compatibility; interference suppression; printed circuit design; EMC CAD package; PCB model; RFI prediction/reduction; circuit design; circuit layout; electronic computing equipment; enclosure design; microprocessor based electronic equipment; radio-frequency interference; thermal design;
fLanguage :
English
Publisher :
iet
Conference_Titel :
Interference and Design for EMC in Microprocessor Based Systems, IEE Colloquium on
Conference_Location :
London
Type :
conf
Filename :
190407
Link To Document :
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