• DocumentCode
    280210
  • Title

    A CAD package for the prediction and reduction of radio-frequency interference from microprocessor based electronic equipment

  • Author

    Marvin, A.C. ; Tealby, J.M. ; Carr-Brion, T.J.F. ; Porter, S.J. ; Mann, S.M.

  • Author_Institution
    York Univ., UK
  • fYear
    1990
  • fDate
    33038
  • Firstpage
    42614
  • Lastpage
    42616
  • Abstract
    The authors describe the production of an EMC CAD package for use in the design of electronic computing equipment. The design of electronic equipment is split up into several separate areas such as circuit design, circuit layout, enclosure design, and thermal design. EMC considerations are taken into account at all stages in the design process
  • Keywords
    circuit layout CAD; electromagnetic compatibility; interference suppression; printed circuit design; EMC CAD package; PCB model; RFI prediction/reduction; circuit design; circuit layout; electronic computing equipment; enclosure design; microprocessor based electronic equipment; radio-frequency interference; thermal design;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Interference and Design for EMC in Microprocessor Based Systems, IEE Colloquium on
  • Conference_Location
    London
  • Type

    conf

  • Filename
    190407