• DocumentCode
    2802315
  • Title

    Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.92CH3095-7)

  • fYear
    1992
  • fDate
    3-5 Feb. 1992
  • Abstract
    The following topics are dealt with: air cooling; liquid cooling; thermal measurement; thermal analysis and matching; thermal characterization; and analysis and modeling of multichip modules
  • Keywords
    cooling; integrated circuit technology; modules; packaging; printed circuits; thermal analysis; thermal variables measurement; air cooling; liquid cooling; multichip modules; semiconductor circuits; thermal analysis; thermal characterization; thermal management; thermal matching; thermal measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 1992. SEMI-THERM VIII., Eighth Annual IEEE
  • Conference_Location
    Austin, TX, USA
  • Print_ISBN
    0-7803-0500-0
  • Type

    conf

  • DOI
    10.1109/STHERM.1992.172841
  • Filename
    172841