DocumentCode
2802364
Title
The application of two-phase push-pull cooling module in pin-fin array electronic device
Author
Chao Yu-Lin ; Chao, Yu-Lin
fYear
1992
fDate
3-5 Feb 1992
Firstpage
97
Lastpage
100
Abstract
A two-phase push-pull cooling module has been developed for cooling a pin-fin array electronic device. The measured results indicate that when the pin-fin array density is increased the performance of the push-pull module is better than that of traditional forced convection. It was also found that in forced convection cooling the temperature in the downstream region is much higher than that of the front region. In comparison, the temperature distribution in the two-phase push-pull cooling module is quite uniform
Keywords
Chaos; Diode lasers; Electronics cooling; Force measurement; Heat sinks; Heat transfer; Industrial electronics; Peace technology; Phased arrays; Temperature distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 1992. SEMI-THERM VIII., Eighth Annual IEEE
Conference_Location
Austin, TX
Print_ISBN
0-7803-0500-0
Type
conf
DOI
10.1109/STHERM.1992.172844
Filename
172844
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