Narrow channel heat sink for cooling of high powered electronic components

Author

Azar, K. ; McLeod, R.S. ; Caron, R.E.

Author_Institution

AT&T Bell Lab., North Andover, MA, USA

fYear

1992

fDate

3-5 Feb 1992

Firstpage

12

Lastpage

19

Abstract

The authors show the results of narrow channel heat sinks used for cooling of high powered components. The results of the experimental simulation for various air delivery methods are reported. The results show the difference in the thermal performance of the heat sink with top clearance versus ducted systems. In addition, effects of component layout power variation and air velocity are shown. A discussion highlighting the optimization of the heat sink in terms of the controlling parameters and fabrication is also presented

Keywords

cooling; heat sinks; printed circuit design; air delivery methods; air velocity; circuit pack layout; component layout; cooling; ducted systems; high powered electronic components; narrow channel heat sinks; thermal performance; top clearance; Electronic components; Electronics cooling; Energy management; Heat sinks; Heat transfer; Hydraulic diameter; Temperature; Thermal engineering; Thermal management; Thermal management of electronics;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 1992. SEMI-THERM VIII., Eighth Annual IEEE

Conference_Location

Austin, TX

Print_ISBN

0-7803-0500-0

Type

conf

DOI

10.1109/STHERM.1992.172847

Filename

172847