DocumentCode :
2802408
Title :
Development of a high performance air cooled heat sink for multi-chip modules
Author :
Kitajo, S. ; Takeda, Y. ; Kurokawa, Y. ; Ohta, T. ; Mizunashi, H.
Author_Institution :
NEC Corp., Kawasaki, Japan
fYear :
1992
fDate :
3-5 Feb 1992
Firstpage :
119
Lastpage :
124
Abstract :
High-performance inversely trapezoidal heat sinks for multi-chip modules under forced air cooling have been developed by means of thermal simulation. Heat sink specifications were assumed as follows: 60 mm (length)×60 mm (width)×17 mm (height) with less than 0.8°C/W thermal resistance at 3 m/s air velocity. A simple thermal simulation method for a heat sink was first developed to perform thermal flow analysis in the air and heat transfer analysis. The accuracy of this simulation was within ±20%, and a novel plate-format heat sink with inversely trapezoidal fins has been successfully designed using this simulation
Keywords :
cooling; heat sinks; heat transfer; modules; packaging; thermal analysis; air cooled heat sink; forced air cooling; heat transfer analysis; inversely trapezoidal heat sinks; multi-chip modules; plate-format heat sink; thermal flow analysis; thermal resistance; thermal simulation; Analytical models; Computational modeling; Cooling; Heat sinks; Heat transfer; National electric code; Performance analysis; Resistance heating; Thermal force; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1992. SEMI-THERM VIII., Eighth Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-0500-0
Type :
conf
DOI :
10.1109/STHERM.1992.172849
Filename :
172849
Link To Document :
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