DocumentCode
2802576
Title
Determination of appropriate thermal transport properties for electronics applications
Author
Tye, R.P. ; Maesono, A.
fYear
1992
fDate
3-5 Feb 1992
Firstpage
37
Lastpage
40
Abstract
A new technique based on AC calorimetry has been developed to measure the thermal diffusivity and specific heat of specimens less than 0.3 mm thick over a broad temperature range. Examples of its application, for various material types and layer composites used in electronic applications, are provided and discussed. Current improvements in the technique to enable measurements to be made on fibers and wires are discussed
Keywords
Composite materials; Conducting materials; Electronic packaging thermal management; Electronics packaging; Optical materials; Semiconductor materials; Solids; Thermal conductivity; Thermal engineering; Thickness measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 1992. SEMI-THERM VIII., Eighth Annual IEEE
Conference_Location
Austin, TX
Print_ISBN
0-7803-0500-0
Type
conf
DOI
10.1109/STHERM.1992.172865
Filename
172865
Link To Document