Title :
Determination of appropriate thermal transport properties for electronics applications
Author :
Tye, R.P. ; Maesono, A.
Abstract :
A new technique based on AC calorimetry has been developed to measure the thermal diffusivity and specific heat of specimens less than 0.3 mm thick over a broad temperature range. Examples of its application, for various material types and layer composites used in electronic applications, are provided and discussed. Current improvements in the technique to enable measurements to be made on fibers and wires are discussed
Keywords :
Composite materials; Conducting materials; Electronic packaging thermal management; Electronics packaging; Optical materials; Semiconductor materials; Solids; Thermal conductivity; Thermal engineering; Thickness measurement;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1992. SEMI-THERM VIII., Eighth Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-0500-0
DOI :
10.1109/STHERM.1992.172865
