• DocumentCode
    2802759
  • Title

    A fully monolithic HMIC low noise amplifier

  • Author

    Boles, T.

  • Author_Institution
    M/A-COM Inc., Burlington, MA, USA
  • fYear
    1997
  • fDate
    10-10 June 1997
  • Firstpage
    109
  • Lastpage
    112
  • Abstract
    A two/three stage monolithic silicon low noise amplifier has been designed utilizing SPICE modeling techniques. The circuit design architecture is based on high frequency, small signal BJTs, consisting of an grounded emitter stage at the input and a Darlington configured pair at the device output. A resistor network, with a bypass capacitor, is utilized not only to provide proper DC biasing for each stage, but also obtain impedance matching to 50 ohms at the circuit input and output and to provide RF feedback for the desired broad band gain response. A patented HMIC (Heterolithic Microwave Integrated Circuit) glass process is employed to provide both the required collector isolation between active device stages and as an extremely low loss dielectric medium for minimum parasitic, high Q passive, reactive elements.
  • Keywords
    MMIC amplifiers; SPICE; bipolar MMIC; circuit analysis computing; feedback amplifiers; glass; impedance matching; integrated circuit design; microwave amplifiers; DC biasing; Darlington configured pair; HMIC glass process; RF feedback; SPICE modeling techniques; broad band gain response; circuit design architecture; collector isolation; grounded emitter stage; heterolithic microwave integrated circuit; high Q passive reactive elements; impedance matching; low loss dielectric medium; low noise amplifier; monolithic HMIC LNA; small signal BJTs; three stage LNA; two stage LNA; Capacitors; Circuit noise; Circuit synthesis; Dielectric losses; Frequency; Impedance matching; Low-noise amplifiers; Resistors; SPICE; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radio Frequency Integrated Circuits (RFIC) Symposium, 1997., IEEE
  • Conference_Location
    Denver, CO, USA
  • Print_ISBN
    0-7803-4063-9
  • Type

    conf

  • DOI
    10.1109/RFIC.1997.598754
  • Filename
    598754