• DocumentCode
    2802937
  • Title

    Integrated Design & Test: Conquering the Conflicting Requirements of Low-Power, Variation-Tolerance and Test Cost

  • Author

    Goel, Ashish ; Ghosh, Swaroop ; Meterelliyoz, Mesut ; Parkhurst, Jeff ; Roy, Kaushik

  • Author_Institution
    Purdue Univ., West Lafayette, IN, USA
  • fYear
    2011
  • fDate
    20-23 Nov. 2011
  • Firstpage
    486
  • Lastpage
    491
  • Abstract
    Design objectives of robustness and low-power usually do not go hand in hand with the test objectives of maximum test coverage and minimum test cost. Low power robust design techniques such as dual-Vth, dual-VDD, or adaptive body biasing have negative impact on the associated test cost. Similarly, test techniques like enhanced scan have large overhead in terms of area and power. In this paper, we try to mitigate the conflicting design and test requirements using an integrated approach to design and test that utilizes the existing low power and error resilient design techniques and augments them to improve test coverage and cost. Simulation results on an example 8×8 Wallace tree multiplier in 90nm technology node show 20% reduction in operating power, 60% reduction in test power and 99% reduction in critical paths while at the same time improving the yield from 96% to 100%, compared to existing design and test methodologies. All this comes at the cost of a marginal increase in area (7.8%).
  • Keywords
    integrated circuit design; integrated circuit testing; low-power electronics; multiplying circuits; 8x8 Wallace tree multiplier technology; adaptive body biasing; dual-VDD biasing; dual-Vth biasing; error resilient design technique; integrated design; integrated testing; low power resilient design technique; low power robust design technique; maximum test coverage; minimum test cost; size 90 nm; Adders; Circuit faults; Delay; Logic gates; Sensors; Testing; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Symposium (ATS), 2011 20th Asian
  • Conference_Location
    New Delhi
  • ISSN
    1081-7735
  • Print_ISBN
    978-1-4577-1984-4
  • Type

    conf

  • DOI
    10.1109/ATS.2011.100
  • Filename
    6114721