Title :
Reliability: A Cross-Disciplinary and Cross-Layer Approach
Author_Institution :
Microelectron. Syst. Design Res. Group, Univ. of Kaiserslautern, Kaiserslautern, Germany
Abstract :
Reliability is the next big challenge if CMOS scaling will continue. To solve this challenge, cross-disciplinary approaches become mandatory in which experts from different disciplines like hardware, software, OS and methodology have to cooperate deeply. All levels with appropriate abstractions have to be explored and the scope of the investigations has to be expanded to the application and quality-of-service level.
Keywords :
CMOS integrated circuits; integrated circuit reliability; quality of service; scaling circuits; CMOS scaling; cross-disciplinary approach; cross-layer approach; quality-of-service level; reliability; Decoding; Hardware; Iterative decoding; Quality of service; Reliability; Resilience; Signal to noise ratio; Reliability; Turbo Code; Wireless Communication;
Conference_Titel :
Test Symposium (ATS), 2011 20th Asian
Conference_Location :
New Delhi
Print_ISBN :
978-1-4577-1984-4
DOI :
10.1109/ATS.2011.21