Title :
3D Specific Systems: Design and CAD
Author :
Franzon, Paul D. ; Davis, W. Rhett ; Thorolfsson, Thor ; Melamed, Samson
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Abstract :
3D stacking and integration can provide significant system advantages. Following a brief technology review, this abstract explores application drivers, design and CAD for 3D ICs. The main 3D exploitation explored in detail is that of logic on memory. This application is explored in a specific DSP example, showing a 25% power advantage when implemented in 3D compared with 2D. Finally critical areas that need better solutions are explored. These include cost management, design planning, test management, and thermal management.
Keywords :
CAD; integrated circuit design; three-dimensional integrated circuits; 3D IC; 3D exploitation; 3D integration; 3D specific systems; 3D stacking; CAD; DSP; cost management; design planning; test management; thermal management; Bandwidth; Memory management; Silicon; Stacking; Thermal analysis; Three dimensional displays; Through-silicon vias; 3D IC; 3DIC; FFT; TSV; memory on logic; stacked memory; three dimensional IC;
Conference_Titel :
Test Symposium (ATS), 2011 20th Asian
Conference_Location :
New Delhi
Print_ISBN :
978-1-4577-1984-4
DOI :
10.1109/ATS.2011.99
