DocumentCode
2804011
Title
3D Specific Systems: Design and CAD
Author
Franzon, Paul D. ; Davis, W. Rhett ; Thorolfsson, Thor ; Melamed, Samson
Author_Institution
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
fYear
2011
fDate
20-23 Nov. 2011
Firstpage
470
Lastpage
473
Abstract
3D stacking and integration can provide significant system advantages. Following a brief technology review, this abstract explores application drivers, design and CAD for 3D ICs. The main 3D exploitation explored in detail is that of logic on memory. This application is explored in a specific DSP example, showing a 25% power advantage when implemented in 3D compared with 2D. Finally critical areas that need better solutions are explored. These include cost management, design planning, test management, and thermal management.
Keywords
CAD; integrated circuit design; three-dimensional integrated circuits; 3D IC; 3D exploitation; 3D integration; 3D specific systems; 3D stacking; CAD; DSP; cost management; design planning; test management; thermal management; Bandwidth; Memory management; Silicon; Stacking; Thermal analysis; Three dimensional displays; Through-silicon vias; 3D IC; 3DIC; FFT; TSV; memory on logic; stacked memory; three dimensional IC;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Symposium (ATS), 2011 20th Asian
Conference_Location
New Delhi
ISSN
1081-7735
Print_ISBN
978-1-4577-1984-4
Type
conf
DOI
10.1109/ATS.2011.99
Filename
6114777
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