DocumentCode :
2804216
Title :
Simulation of Thermal Comfort in Air-Conditioning Room by Aripak
Author :
Qin, Lin ; Wang, Cai ; Wei, Lifeng
Author_Institution :
Beijing Univ. of Civil Eng. & Archit., Beijing, China
fYear :
2009
fDate :
11-13 Dec. 2009
Firstpage :
1
Lastpage :
4
Abstract :
This paper studied on an air-conditioning classroom which was influenced by both cold jet and buoyancy force of heat source, and numerical simulation of indoor thermal environment of turbulence heat transfer in summer steady-state condition was carried out by using simulation software Aripak. According to two major evaluating indices of thermal comfort, simulation showed the change relation of distribution of PMV, PPD and air age in different heights in the room. The study indicated that, to make sure good thermal comfort, proper supply air parameters would make the indoor air form better backflow, shorter air age , and bring away the heat around the radiating equipments to make the radiation temperature not too high. Furthermore, the thermal comfort was not good in such areas which were near heating radiator with high temperature, around air outlets where cold air sinks and room corners where eddy flow was usually formed. However, in working area, thermal comfort distribution was uniform, air was fresh and has shorter air age, which would met the requirement. The study provided method and theoretical basis for forecasting the heat environment condition in the occupied zone, and provided very important reference value to improve the thermal environment of air-conditioning room.
Keywords :
HVAC; air conditioning; cooling; Aripak; air age; air backflow; air outlet; air-conditioning classroom; buoyancy force; cold jet; eddy flow; heat source; heating radiator; indoor air; indoor thermal environment; numerical simulation; radiation temperature; summer steady-state condition; thermal comfort simulation; turbulence heat transfer; Computational fluid dynamics; Heat engines; Heat transfer; Humans; Humidity; Medical simulation; Numerical simulation; Temperature; Thermal engineering; Thermal force;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computational Intelligence and Software Engineering, 2009. CiSE 2009. International Conference on
Conference_Location :
Wuhan
Print_ISBN :
978-1-4244-4507-3
Electronic_ISBN :
978-1-4244-4507-3
Type :
conf
DOI :
10.1109/CISE.2009.5362615
Filename :
5362615
Link To Document :
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