A high speed laser package for optical communications

Author

Lawson, P. ; Collins, J.V.

Author_Institution

British Telecom Res. Labs., Ipswich, UK

fYear

1990

fDate

33172

Firstpage

42552

Lastpage

42557

Abstract

Describes work which is currently being undertaken at British Telecom Research Laboratories (BTRL) in response to the demand for a highspeed laser package for a variety of system applications. At present, commercial packages are limited in bandwidth to a few gigahertz, whereas laser chips have been reported to at least 18 GHz. In order to evaluate these higher speed chips a test fixture is required, and for use in real systems, a package which meets practical electrical, optical, thermal, mechanical, and environmental conditions must be developed. A test fixture designed for laser chip assessment, and a package developed to host the laser and associated components are described, along with results obtained. The problems of intrapackage connection and interfacing are also addressed

Keywords

integrated circuit testing; laser variables measurement; microwave measurement; optical communication equipment; semiconductor junction lasers; test equipment; 18 GHz; BTRL; British Telecom Research Laboratories; bandwidth; electrical conditions; environmental conditions; high speed laser package; interfacing; intrapackage connection; laser chips; mechanical conditions; microwave lasers; optical communications; optical conditions; test fixture;

fLanguage

English

Publisher

iet

Conference_Titel

Microwave Optoelectronics, IEE Colloquium on

Conference_Location

London

Type

conf

Filename

190730