DocumentCode
2804618
Title
Thermal modeling and management of the integrated HID ballast
Author
Jiang, Yan ; Wang, Shuo ; Lee, Fred C.
Author_Institution
GE Global Res. Center, Niskayuna, NY, USA
fYear
2010
fDate
12-16 Sept. 2010
Firstpage
3009
Lastpage
3013
Abstract
High power density electronic ballast is desired for the High Intensity Discharge (HID) lamps in order to fully utilize the space inside the lamp fixture and reduce the overall size. However, by installing the ballast inside the lamp fixture, the ambient temperature for the ballast will be higher, and combined with the reduced size, the thermal condition for the integrated ballast will be much harsher. Therefore the detail thermal analysis and proper management is a must for the high power density ballast design. In this paper, a thermal simulation model of the integrated ballast is developed with experimental calibration, with which the thermal performance of the ballast within a plastic fixture is studied. The thermal management methods to reduce the peak temperature are also investigated and discussed based on the model. Experiments results verified the validity of the proposed model and thermal management approaches.
Keywords
discharge lamps; lamp accessories; plastics; thermal analysis; ambient temperature; high intensity discharge lamp; high power density electronic ballast; integrated HID ballast; lamp fixture; plastic fixture; thermal analysis; thermal management; thermal simulation model; Conductivity; Electronic ballasts; Heating; High intensity discharge lamps; Plastics; Temperature measurement; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Energy Conversion Congress and Exposition (ECCE), 2010 IEEE
Conference_Location
Atlanta, GA
Print_ISBN
978-1-4244-5286-6
Electronic_ISBN
978-1-4244-5287-3
Type
conf
DOI
10.1109/ECCE.2010.5618366
Filename
5618366
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