• DocumentCode
    2804618
  • Title

    Thermal modeling and management of the integrated HID ballast

  • Author

    Jiang, Yan ; Wang, Shuo ; Lee, Fred C.

  • Author_Institution
    GE Global Res. Center, Niskayuna, NY, USA
  • fYear
    2010
  • fDate
    12-16 Sept. 2010
  • Firstpage
    3009
  • Lastpage
    3013
  • Abstract
    High power density electronic ballast is desired for the High Intensity Discharge (HID) lamps in order to fully utilize the space inside the lamp fixture and reduce the overall size. However, by installing the ballast inside the lamp fixture, the ambient temperature for the ballast will be higher, and combined with the reduced size, the thermal condition for the integrated ballast will be much harsher. Therefore the detail thermal analysis and proper management is a must for the high power density ballast design. In this paper, a thermal simulation model of the integrated ballast is developed with experimental calibration, with which the thermal performance of the ballast within a plastic fixture is studied. The thermal management methods to reduce the peak temperature are also investigated and discussed based on the model. Experiments results verified the validity of the proposed model and thermal management approaches.
  • Keywords
    discharge lamps; lamp accessories; plastics; thermal analysis; ambient temperature; high intensity discharge lamp; high power density electronic ballast; integrated HID ballast; lamp fixture; plastic fixture; thermal analysis; thermal management; thermal simulation model; Conductivity; Electronic ballasts; Heating; High intensity discharge lamps; Plastics; Temperature measurement; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2010 IEEE
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    978-1-4244-5286-6
  • Electronic_ISBN
    978-1-4244-5287-3
  • Type

    conf

  • DOI
    10.1109/ECCE.2010.5618366
  • Filename
    5618366