DocumentCode
2805210
Title
Electrical Performance of Electronic Packaging
fYear
2004
fDate
25-27 Oct. 2004
Abstract
The following topics are dealt with: transmission lines; RF and microwave techniques; noise reduction; power distribution; electromagnetic modeling; on chip issues.
Keywords
electronics packaging; integrated circuit technology; microstrip lines; transmission line theory; RF techniques; electrical performance; electromagnetic modeling; electronics packaging; microwave techniques; noise reduction; on chip issues; power distribution; transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on
Conference_Location
Portland, OR, USA
Print_ISBN
0-7803-8667-1
Type
conf
DOI
10.1109/EPEP.2004.1407515
Filename
1407515
Link To Document