Title :
A sensitivity equation method for molding processes
Author_Institution :
Dept. of Math. Sci., Montana State Univ., Bozeman, MT, USA
Abstract :
Describes a sensitivity equation method for elliptic interface problems where the parameter of interest determines the spatial location of the interface. Elliptic differential equations of this type are often characterized by discontinuous coefficients and, in some instances, these equations may have discontinuous solutions or flux terms. The computational method constructed in the paper uses an iterative, non-overlapping domain decomposition algorithm. Preliminary results indicate that the algorithm works well under optimal conditions
Keywords :
boundary-value problems; differential equations; elliptic equations; gradient methods; iterative methods; moulding; sensitivity; temperature distribution; discontinuous coefficients; elliptic differential equations; elliptic interface problems; iterative nonoverlapping domain decomposition algorithm; molding processes; optimal conditions; sensitivity equation method; spatial location; Boundary conditions; Conducting materials; Conductivity; Die casting; Differential equations; Filling; Partial differential equations; Shape; Steady-state; Temperature distribution;
Conference_Titel :
Control Applications, 2000. Proceedings of the 2000 IEEE International Conference on
Conference_Location :
Anchorage, AK
Print_ISBN :
0-7803-6562-3
DOI :
10.1109/CCA.2000.897478
