DocumentCode :
2805760
Title :
Electromagnetic modeling as a constituent of multi-disciplined design
Author :
Buris, Nicholas E.
Author_Institution :
Motorola Inc., Schaumburg, IL, USA
fYear :
2004
fDate :
25-27 Oct. 2004
Firstpage :
35
Abstract :
A scalable framework of multi-disciplined design that is able to accommodate any geometric based design discipline is presented. Of the several challenges in the way of high fidelity, physics based design and modeling are the focus of This work. The complexity of a problem described in its raw geometry is overwhelming. The second challenge discussed in This work is the coupling of most, if not all disciplines in an optimization problem when described at the geometric level. Often, the degree of discipline coupling is a function of the type and level of optimization that one is "willing" to pursue, or ignore. Application examples are given in the area of electromagnetic and structural analyses for components appearing in cellular phones.
Keywords :
cellular radio; circuit optimisation; electronic design automation; cellular phones; discipline coupling; electromagnetic analyses; electromagnetic modeling; electronic design automation; geometric based design; multidisciplined design; optimization; structural analyses; Cellular phones; Electromagnetic modeling; Electronic circuits; Electronic packaging thermal management; Electronics packaging; Geometry; Physics; Structural engineering; Tellurium; Thermal engineering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on
Print_ISBN :
0-7803-8667-1
Type :
conf
DOI :
10.1109/EPEP.2004.1407539
Filename :
1407539
Link To Document :
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