A monolithic, compact balun/matching network for SiP applications

Author

Frye, Robert C. ; Badakere, Guruprasad ; Lin, Yaojian ; Chelvam, M. Pandi

Author_Institution

RF Design Consulting LLC, Piscataway, NJ, USA

fYear

2004

fDate

25-27 Oct. 2004

Firstpage

37

Lastpage

40

Abstract

We describe a circuit and design method for a compact balun/matching network suitable for a variety of RF application using thin-film integrated passive device (IPD) technology. The circuit uses resonant coupled inductors. By appropriate tuning of the capacitors in the circuit, the balun can be made to match a wide range of impedances. Measured results of example circuits for 802.11 b/g or Bluetooth applications (2.4-2.5 GHz) are presented, showing excellent agreement with simulation.

Keywords

Bluetooth; baluns; capacitors; circuit tuning; impedance matching; inductors; integrated circuit design; integrated circuit packaging; monolithic integrated circuits; radiofrequency integrated circuits; thin film circuits; 2.4 to 2.5 GHz; Bluetooth; SiP; capacitor tuning; circuit design; compact balun network; compact matching network; impedance matching; monolithic network; resonant coupled inductors; system-in-package applications; thin film integrated passive device technology; Coupling circuits; Design methodology; Impedance matching; Integrated circuit technology; RLC circuits; Radio frequency; Resonance; Thin film circuits; Thin film devices; Thin film inductors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on

Print_ISBN

0-7803-8667-1

Type

conf

DOI

10.1109/EPEP.2004.1407540

Filename

1407540