Title :
2.5 Gbps Infiniband copper cable interconnect compliance
Author_Institution :
Scalable Syst. Group, Sun MicroSyst. Inc., Oslo, Norway
Abstract :
This work puts a focus on the problems facing a board designer when implementing 2.5 Gbps Infiniband board to board electrical interconnect via a copper cable. To be compliant to specification, in low-cost, high volume packaging, using standard FR4 PCB technology, may be a great challenge.
Keywords :
cables (electric); copper; electronics packaging; interconnections; printed circuit design; printed circuits; 2.5 Gbit/s; Cu; Infiniband copper cable; board designer; board electrical interconnect; high volume packaging; standard FR4 PCB technology; Assembly systems; Attenuation; Connectors; Copper; Costs; Fabrics; Mechanical cables; Packaging; Sun; Topology;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on
Print_ISBN :
0-7803-8667-1
DOI :
10.1109/EPEP.2004.1407548
