DocumentCode
2806157
Title
Characterization of current signatures for microprocessors
Author
Weekly, Roger ; Chun, Sungjun ; O´Connell, Frank
Author_Institution
IBM Corp., Austin, TX, USA
fYear
2004
fDate
25-27 Oct. 2004
Firstpage
95
Lastpage
98
Abstract
This work presents current signatures for a set of test cases running on a general purpose server IBM POWER5™ processor under the control of IBM´s AIX™ operating system. This is part of activities focused on understanding how to optimize the power delivery infrastructure with respect to total system cost. Specifically a better understanding of the current signatures of processors coupled with better understanding of how to design the decoupling infrastructure and in what ways the processor circuits are susceptible to power domain voltage noise is expected to help us accomplish this.
Keywords
IBM computers; Unix; computer power supplies; distribution networks; microprocessor chips; network servers; IBM AIX™ operating system; IBM POWER5™ processor; current signature characterization; decoupling infrastructure; general purpose server; microprocessors; power delivery infrastructure; power domain voltage noise; processor circuits; Frequency; Metallization; Microprocessors; Narrowband; Operating systems; Process control; Semiconductor device measurement; Surface-mount technology; Testing; Voltage measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on
Print_ISBN
0-7803-8667-1
Type
conf
DOI
10.1109/EPEP.2004.1407556
Filename
1407556
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