Modeling the impact of power/ground via arrays on power delivery

Author

Miller, Jason R. ; Novak, Istvan

Author_Institution

Sun MicroSysterms Inc., Burlington, MA, USA

fYear

2004

fDate

25-27 Oct. 2004

Firstpage

119

Lastpage

122

Abstract

The impact of via arrays on power and ground planes is examined in This work. Measurements of the plane impedance were made on a 8×8 via array as a function of via pair location. The results from full-wave field solution are compared to measurement data and excellent correlation is obtained. The results show that the impedance and effective inductance is a strong function of location within the array. The lowest impedance and inductance is measured on the array perimeter. A 4 X increase in the impedance and inductance occurs at the array center. By parameterizing the antipad diameter in simulation it is found that the impedance increases sharply when the antipads overlap.

Keywords

ball grid arrays; electric impedance measurement; inductance measurement; antipad diameter; array perimeter; ball grid arrays; full wave field solution; inductance measurement; plane impedance measurement; power delivery; power-ground via arrays; via pair location; Circuit simulation; Current supplies; Impedance measurement; Inductance measurement; Packaging; Power supplies; Printed circuits; Sun; Testing; Transmission line matrix methods;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on

Print_ISBN

0-7803-8667-1

Type

conf

DOI

10.1109/EPEP.2004.1407562

Filename

1407562