DocumentCode :
2806668
Title :
Error factors in transmission line analysis with 3-dimensional electromagnetic field simulations
Author :
KUBOTA, Hidemasa ; Watanabe, Takayuki ; Araki, Kenji ; Asai, Hideki
Author_Institution :
Dept. of Syst. Eng., Shizuoka Univ., Hamamatsu, Japan
fYear :
2004
fDate :
25-27 Oct. 2004
Firstpage :
163
Lastpage :
166
Abstract :
In this work, the accuracy of FDTD simulation by the comparison of S-parameters, which are obtained by FDTD method and experimental measurement in the analysis of the printed circuit boards with simple structured signal line. In comparison of S-parameters of signal lines, the disparity occurred from cell size is regarded as the mismatch of the characteristic impedance of the modeled signal lines. An attempt is made to decide the adequate cell size by estimation of the characteristic impedance based on finite difference method (FDM). In addition, an efficient technique to compensate the characteristic impedance is described. It is expected that this study is useful for the verification of signal integrity.
Keywords :
S-parameters; electromagnetic field theory; finite difference time-domain analysis; printed circuits; transmission line theory; 3-dimensional electromagnetic field simulation; FDTD simulation; S-parameters; characteristic impedance estimation; error factors; finite difference method; finite difference time domain simulation; printed circuit boards; signal integrity verification; transmission signal line analysis; Analytical models; Circuit simulation; Distributed parameter circuits; Electromagnetic analysis; Electromagnetic fields; Finite difference methods; Impedance; Scattering parameters; Time domain analysis; Transmission lines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on
Print_ISBN :
0-7803-8667-1
Type :
conf
DOI :
10.1109/EPEP.2004.1407573
Filename :
1407573
Link To Document :
بازگشت