DocumentCode :
2806718
Title :
Fault coverage estimation model for partially testable multichip modules
Author :
Tseng, Wang-Dauh ; Wang, Kuochen
Author_Institution :
Dept. of Comput. & Inf. Sci., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear :
1997
fDate :
15-16 Dec 1997
Firstpage :
72
Lastpage :
77
Abstract :
This paper proposes a simple and efficient model for designers to estimate fault coverage for partially testable MCMs. This model relates fault coverage, test methodology, and the ratio and distribution of DFT dies (dies with design for testability features) in an MCM. Experimental results show that our model can efficiently predict the fault coverage of a partially testable MCM with less than 5% deviation. In addition, the upper bound for fault coverage is also analyzed to guide the designers to know when to stop the effort in planning the use of DFT dies. Two defect level estimation models which relate fault coverage and manufacturing yield for measuring the test quality of MCMs under equiprobable and non-equiprobable faults, respectively, are also presented and evaluated
Keywords :
design for testability; electrical engineering computing; integrated circuit testing; multichip modules; defect level estimation models; design for testability; fault coverage; fault coverage estimation model; manufacturing yield; partially testable multichip modules; test methodology; upper bound; Built-in self-test; Circuit faults; Circuit testing; Controllability; Design for testability; Information science; Logic design; Logic testing; Multichip modules; Observability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Fault-Tolerant Systems, 1997. Proceedings., Pacific Rim International Symposium on
Conference_Location :
Taipei
Print_ISBN :
0-8186-8212-4
Type :
conf
DOI :
10.1109/PRFTS.1997.640128
Filename :
640128
Link To Document :
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