DocumentCode
2807132
Title
In-situ measurement of impedance of die power delivery system
Author
Kantorovich, Isaac ; Drabkin, Victor ; Houghton, Chris ; St Laurent, Jim
Author_Institution
Intel, Hudson, MA, USA
fYear
2004
fDate
25-27 Oct. 2004
Firstpage
229
Lastpage
232
Abstract
The modified method of measurement of impedance of die power delivery system is presented. In contrast to the previous approach, the proposed methodology includes a new method of detailed reconstruction of the on-chip current for a step-wise computer process. The new methodology is based on representation of a chip as a variable resistor. The measurement results show the most pronounced difference between the new and previous methodologies in the frequency regions of power delivery resonances. The difference is higher for chips with higher Q-factors.
Keywords
Q-factor; computer power supplies; electric impedance measurement; integrated circuit measurement; resistors; system-on-chip; Q-factors; chip representation; die power delivery system; impedance measurement; on-chip current reconstruction; power delivery resonances; step-wise computer process; variable resistor; Clocks; Delay estimation; Equivalent circuits; Frequency; Impedance measurement; Power measurement; Resistors; Resonance; Semiconductor device measurement; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on
Print_ISBN
0-7803-8667-1
Type
conf
DOI
10.1109/EPEP.2004.1407594
Filename
1407594
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