DocumentCode :
2807173
Title :
[Copyright notice]
fYear :
2007
fDate :
1-3 Oct. 2007
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-1636-3
Type :
conf
DOI :
10.1109/IMPACT.2007.4433553
Filename :
4433553
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2807173
