DocumentCode
2807187
Title
Foreword
fYear
2007
fDate
1-3 Oct. 2007
Keywords
Assembly; Circuits; Energy management; Environmental management; Packaging machines; Paper technology; Supply chain management; Technology management; Thermal management; Thermal management of electronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International
Conference_Location
Taipei, Taiwan
Print_ISBN
978-1-4244-1637-0
Electronic_ISBN
978-1-4244-1637-0
Type
conf
DOI
10.1109/IMPACT.2007.4433554
Filename
4433554
Link To Document