Abstract :
The following topics are dealt with: design & modeling of advanced packaging; modeling, testing & design; advanced packaging technology; advanced microsystems technology; material process & equipment; green packing & assembly; HDI & embedded technology; metal finishing; green PCB & PCBA; and green materials & assembly.
Keywords :
assembling; electronics packaging; embedded systems; finishing; integrated circuit interconnections; micromechanical devices; printed circuits; HDI; PCBA; advanced microsystems technology; advanced packaging technology; embedded technology; green PCB; green materials; green packing; material process; metal finishing;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-1636-3
DOI :
10.1109/IMPACT.2007.4433555
