DocumentCode
2807222
Title
Is IDDQ Test of Microprocessors Feasible?
Author
Xue, Bin ; Walker, D.M.H.
Author_Institution
Dept. of Comput. Sci., Texas A&M Univ., College Station, TX
fYear
2005
fDate
Nov. 2005
Firstpage
63
Lastpage
69
Abstract
Quiescent leakage current (Iddq) test has proven very effective for detecting defects that escape other test methods, such as small delay faults or reliability hazards. However, leakage currents in microprocessors, digital signal processors, and graphics processors have risen to the point that these products no longer use Iddq test. Quality must be achieved through other test methods, often at higher development and application cost. We propose to bring Iddq test back to high performance chips by using a practical built-in current sensor (BICS). 180 nm test chip results show that a small sensor can achieve a resolution of 54 muA, which is adequate to detect most small delay defects and reliability hazards
Keywords
circuit testing; electric current measurement; electric sensing devices; leakage currents; microprocessor chips; 180 nm; 54 muA; Iddq test; built in current sensor; defects detection; microprocessors; quiescent leakage current; reliability hazards; small delay defects; test chip; Costs; Delay effects; Digital signal processors; Fault detection; Graphics; Hazards; Leak detection; Leakage current; Microprocessors; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocessor Test and Verification, 2005. MTV '05. Sixth International Workshop on
Conference_Location
Austin, TX
ISSN
1550-4093
Print_ISBN
0-7695-2627-6
Type
conf
DOI
10.1109/MTV.2005.13
Filename
4022230
Link To Document