• DocumentCode
    2807222
  • Title

    Is IDDQ Test of Microprocessors Feasible?

  • Author

    Xue, Bin ; Walker, D.M.H.

  • Author_Institution
    Dept. of Comput. Sci., Texas A&M Univ., College Station, TX
  • fYear
    2005
  • fDate
    Nov. 2005
  • Firstpage
    63
  • Lastpage
    69
  • Abstract
    Quiescent leakage current (Iddq) test has proven very effective for detecting defects that escape other test methods, such as small delay faults or reliability hazards. However, leakage currents in microprocessors, digital signal processors, and graphics processors have risen to the point that these products no longer use Iddq test. Quality must be achieved through other test methods, often at higher development and application cost. We propose to bring Iddq test back to high performance chips by using a practical built-in current sensor (BICS). 180 nm test chip results show that a small sensor can achieve a resolution of 54 muA, which is adequate to detect most small delay defects and reliability hazards
  • Keywords
    circuit testing; electric current measurement; electric sensing devices; leakage currents; microprocessor chips; 180 nm; 54 muA; Iddq test; built in current sensor; defects detection; microprocessors; quiescent leakage current; reliability hazards; small delay defects; test chip; Costs; Delay effects; Digital signal processors; Fault detection; Graphics; Hazards; Leak detection; Leakage current; Microprocessors; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microprocessor Test and Verification, 2005. MTV '05. Sixth International Workshop on
  • Conference_Location
    Austin, TX
  • ISSN
    1550-4093
  • Print_ISBN
    0-7695-2627-6
  • Type

    conf

  • DOI
    10.1109/MTV.2005.13
  • Filename
    4022230