Title :
Fine pitch “NCF-type compliant-bumped COG”
Author :
An, Chao-Chyun ; Chang, Shyh-Ming ; Chen, Ming-Yao ; Kao, Kuo-Shu ; Tsang, Jimmy ; Yang, Sheng-Shu ; Chen, Chih ; Lin, Chung-Kuang ; Chen, Ren-Haw ; Chen, Wen-Chih
Author_Institution :
Display Technol. Center, Hsinchu
Abstract :
Non-Conductive-Film (NCF) type of Chip-on-Glass (COG) bonding method ensures the micro-order direct bonding between the IC electrode and glass substrate electrode. The binding force of the applied adhesive achieves electrical connections between the bumps on the IC chip and the electrodes on the glass substrate. The mathematical calculation results of bump stress and bump deformation are used to identify the environmental temperature range for the given COG bonding structure. Both of the calculation and experimental results demonstrate the feasibility of using the compliant bumps to achieve a high compressive stress, high bump deformation and low as well as stable connection resistance at various environmental temperatures. The 1,000 hrs 85degC/85%RH reliability test result will be indicated.
Keywords :
electrodes; fine-pitch technology; integrated circuit bonding; integrated circuit interconnections; COG bonding structure; IC chip; IC electrode; binding force; bump stress; chip-on-glass bonding method; compressive stress; electrical connections; environmental temperature range; fine pitch NCF-type compliant-bumped COG; glass substrate electrode; high bump deformation; micro-order direct bonding; nonconductive-film; time 1000 hr; Bonding; Compressive stress; Electrodes; Glass; Liquid crystal displays; Materials science and technology; Substrates; Temperature; Thermal expansion; Thermal stresses;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-1636-3
Electronic_ISBN :
978-1-4244-1637-0
DOI :
10.1109/IMPACT.2007.4433558
