DocumentCode
2807278
Title
The measurement developing of wafer level MEMS microphone
Author
Lu, Hui-Chuan ; Chan, Wei-Liang ; Lee, Hsui-Li ; Fang, Yu-Jen ; Hsiao, Chieh-Ling ; Wang, Chih-Hung ; Chang, Peter ; Huang, Chin-Ching ; Tu, Ming-Te
Author_Institution
Ind. Technol. Res. Inst. South, Tainan
fYear
2007
fDate
1-3 Oct. 2007
Firstpage
18
Lastpage
21
Abstract
This paper investigates about characteristic measurement methods and experimental results for micro-capacitance and electro-acoustics of wafer level MEMS microphone. And this paper also studies packaging and measurement for the microphone product to verify yield of semi-finished products from the measurement methods to save cost of the production. The repeatability of the micro-capacitance measurement system is high, and construction of direct sound source with high stability and uniformity can make high repeatability and can help understand more about impact of reflection of acoustic field for measuring the sound intensity.
Keywords
acoustoelectric devices; capacitance measurement; micromechanical devices; microphones; electro-acoustics; microcapacitance measurement; wafer level MEMS microphone; Acoustic measurements; Capacitance measurement; Capacitance-voltage characteristics; Micromechanical devices; Microphones; Packaging; Pressure measurement; Sensor phenomena and characterization; Voltage; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International
Conference_Location
Taipei
Print_ISBN
978-1-4244-1636-3
Electronic_ISBN
978-1-4244-1637-0
Type
conf
DOI
10.1109/IMPACT.2007.4433559
Filename
4433559
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