Title :
A Stacked Mesh 3D NoC Architecture Enabling Congestion-Aware and Reliable Inter-layer Communication
Author :
Rahmani, Amir-Mohammad ; Latif, Khalid ; Liljeberg, Pasi ; Plosila, Juha ; Tenhunen, Hannu
Author_Institution :
Turku Centre for Comput. Sci. (TUCS), Turku, Finland
Abstract :
In this paper, an efficient architecture to optimize system performance, power consumption, and reliability of stacked mesh 3D NoC is proposed. Stacked mesh is a feasible architecture which takes advantage of the short inter-layer wiring delays, while suffering from inefficient intermediate buffers. To cope with this, an inter-layer communication mechanism is developed to enhance the buffer utilization, load balancing, and system fault-tolerance. The mechanism benefits from a congestion-aware and bus failure tolerant routing algorithm for vertical communication. To estimate the efficiency of the proposed architecture, the system has been simulated using uniform, hotspot 10%, and Negative Exponential Distribution (NED) traffic patterns. In addition, a video conference encoder has been used as a real application for system analysis. Our extensive experiments show significant power and performance improvements compared to a typical stacked mesh 3D NoC.
Keywords :
fault tolerance; integrated circuit reliability; network routing; network-on-chip; three-dimensional integrated circuits; NED traffic patterns; buffer utilization; bus failure tolerant routing algorithm; congestion-aware interlayer communication; interlayer wiring delays; load balancing; negative exponential distribution traffic patterns; reliable interlayer communication; stacked mesh 3D NoC architecture; system fault-tolerance; vertical communication; video conference encoder; Algorithm design and analysis; Fault tolerance; Fault tolerant systems; Power demand; Routing; Three dimensional displays; Throughput; 3D ICs; 3D NoC-Bus Hybrid Architecture; Fault Tolerance; Routing Algorithm;
Conference_Titel :
Parallel, Distributed and Network-Based Processing (PDP), 2011 19th Euromicro International Conference on
Conference_Location :
Ayia Napa
Print_ISBN :
978-1-4244-9682-2
DOI :
10.1109/PDP.2011.39