DocumentCode :
2807353
Title :
Order selection in passive transmission line macromodels based on the Lie decomposition
Author :
Elfadel, I.M. ; Huang, Hsuan-Ming
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
2004
fDate :
25-27 Oct. 2004
Firstpage :
251
Lastpage :
254
Abstract :
In a passive macromodel for lossy, dispersive multiconductor transmission lines (MTL´s) has been proposed. The macromodel uses a multiplicative approximation of the matrix exponential known as the Lie product. The circuit implementation of the macromodel is a cascade of elementary cells, each cell being the combination of a pure delay element and a lumped circuit representing the transmission line losses. Compared with passive rational macromodeling, the Lie product macromodel is capable of efficiently simulating long, low-loss MTL´s while preserving passivity. In this paper, we build on the results of and use transmission line theory to derive a new time-domain error criterion for the Lie product macromodel. We also show how this criterion can be used to determine the minimum number of cells needed in the macromodel to guarantee that the magnitude of the time-domain error is below a given engineering tolerance.
Keywords :
Lie algebras; approximation theory; losses; matrix decomposition; multiconductor transmission lines; transmission line theory; Lie decomposition; Lie product macromodel; lumped circuit; matrix exponential approximation; multiconductor transmission lines; multiplicative approximation; order selection; passive rational macromodeling; passive transmission line macromodel; time domain error criterion; transmission line losses; transmission line theory; Delay; Dispersion; Distributed parameter circuits; Matrix decomposition; Multiconductor transmission lines; Propagation losses; Time domain analysis; Transmission line matrix methods; Transmission line theory; Transmission lines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on
Print_ISBN :
0-7803-8667-1
Type :
conf
DOI :
10.1109/EPEP.2004.1407601
Filename :
1407601
Link To Document :
بازگشت