DocumentCode
2807580
Title
A model for bubble motion in non-uniform electric fields
Author
Lewin, P.L. ; Wang, P. ; Swaffield, D.J. ; Chen, G.
Author_Institution
Tony Davies High Voltage Lab., Univ. of Southampton, Southampton
fYear
2008
fDate
June 30 2008-July 3 2008
Firstpage
1
Lastpage
4
Abstract
Electrohydrodynamic effects on bubble motion in dielectric fluids has found positive application for enhanced boiling heat transfer, for example in refrigerators. However the motion of bubbles in columns of dielectric fluid is also of interest where the presence of bubbles may adversely affect the breakdown performance of the liquid dielectric when employed as an electrical insulation. This is the case for superconducting power apparatus designs where liquid nitrogen is used as both coolant and electrical insulation. A model is presented for the bubble motion in a dielectric fluid under the influence of dielectrophoretic force. A model has been developed by analysis of the forces acting upon a bubble within a non-uniform electric field with rod-plane electrode geometry. This set of differential equations can be solved numerically to determine the bubble trajectory for a specified applied voltage. Model results are compared to experimental data for a range of voltages obtained in a column of liquid nitrogen.
Keywords
bubbles; coolants; electric fields; electrohydrodynamics; boiling heat transfer; bubble motion; bubble trajectory; coolant; dielectric fluids; dielectrophoretic force; differential equations; electrical insulation; electrohydrodynamic effects; liquid dielectric; liquid nitrogen; non-uniform electric field; nonuniform electric fields; refrigerators; rod-plane electrode geometry; superconducting power apparatus designs; Coolants; Dielectric breakdown; Dielectric liquids; Dielectrics and electrical insulation; Electrohydrodynamics; Heat transfer; Nitrogen; Nonuniform electric fields; Refrigerators; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Dielectric Liquids, 2008. ICDL 2008. IEEE International Conference on
Conference_Location
Futuroscope-Chasseneuil
Print_ISBN
978-1-4244-1585-4
Electronic_ISBN
978-1-4244-1586-1
Type
conf
DOI
10.1109/ICDL.2008.4622476
Filename
4622476
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