Thermal performance of the IC package integrated with micro- thermoelectric device

The present work aims at the study of the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new device was comprehensive studied. The thermal resistances of IHS with/without TEC were also compared. Moreover, a series of experiments have been carried out to investigate the effects of air velocity and the input power of thermoelectric device. The results showed that the new device that integrated with thermoelectric can reduce the thermal resistance of FC-PBGA package significantly.