DocumentCode :
2807928
Title :
A schematic-based design model for microphone and circuit integration
Author :
Chen, Jen-Yi ; Lee, Shu-Sheng ; Chang, Peter ; Chu, Chun-Hsun ; Mukherjee, Tamal ; Fedder, GaryK
Author_Institution :
Ind. Technol. Res. Inst., Taipei
fYear :
2007
fDate :
1-3 Oct. 2007
Firstpage :
157
Lastpage :
160
Abstract :
The transistor-level elements for condenser microphone design have been implemented in an IC design environment. Arbitrary diaphragm shapes can be composed and simulated by using our basic elements. The sensitivity and frequency response are obtained by co-simulation with the microphone and the readout circuit using Cadence/Spectrereg simulator. The new model is capable of dealing with the multi-field coupling effects including acoustical, mechanical and electrostatic behavior. Comparing to the ANSYS static simulation by using shell63 elements, our design model gives matched results based on the same mesh condition. Both the finite element analysis and theoretical calculated natural frequency agree with the nodal simulation results. Co-simulation enables trade-off analysis between the acousto-electro-mechanical and electronic design parameters. Furthermore, this platform provides a unified design interface between mechanical and electrical engineers, which is critical for top-down design of monolithic microsystems.
Keywords :
finite element analysis; integrated circuit design; microphones; ANSYS static simulation; Cadence-Spectre; IC design; acousto-electro-mechanical design parameters; arbitrary diaphragm shapes; condenser microphone; electronic design parameters; finite element analysis; frequency response; monolithic microsystems; multi-field coupling effects; readout circuit; shell63 elements; transistor-level elements; Acoustical engineering; Analytical models; Circuit simulation; Coupling circuits; Design engineering; Electrostatics; Finite element methods; Frequency response; Microphones; Shape;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-1636-3
Electronic_ISBN :
978-1-4244-1637-0
Type :
conf
DOI :
10.1109/IMPACT.2007.4433590
Filename :
4433590
Link To Document :
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