Title :
The breakdown characteristics of the liquefied SF6
Author :
Eun-Hyuck Choi ; Kim, Se-Dong ; Lim, Chang-Ho ; Choi, Sang-Tae ; Lee, Kwang-Sik
Author_Institution :
Dept. of Electr. Eng., Yeungnam Univ., Gyeongsan
fDate :
June 30 2008-July 3 2008
Abstract :
In this paper the investigation of breakdown characteristics liquefied SF6 (LSF6) in model GIS (gas insulated switchgear) were described. The ability of LSF6 insulation is higher than high-pressurized SF6 gas. The breakdown characteristics of LSF6 were produced by bubble formed evaporation of LSF6 and bubble caused by high electric emission and corona. Also, The property of dielectric breakdown is determined by electrode form, electrode arrangement, bubble formation and movement, arc extinguishing capacity of media, difficulty in corona formation, and the distance between electrodes. The bubble formation and flow separation phenomenon were identified for LSF6. It is considered in this paper that the results are fundamental data for electric insulation design of a high-temperature superconductor and cryogenic equipments machinery which will be studied and developed in the future.
Keywords :
SF6 insulation; bubbles; corona; evaporation; flow separation; gas insulated switchgear; GIS; LSF6 insulation; SF6; SF6 gas; arc extinguishing capacity; breakdown characteristics; bubble formation; bubble formed evaporation; corona; cryogenic equipments; dielectric breakdown; electric emission; electric insulation design; electrode arrangement; electrode form; flow separation phenomenon; gas insulated switchgear; high-temperature superconductor; liquefied SF6; Corona; Cryogenics; Dielectric breakdown; Dielectrics and electrical insulation; Electric breakdown; Electrodes; Gas insulation; Geographic Information Systems; High temperature superconductors; Switchgear;
Conference_Titel :
Dielectric Liquids, 2008. ICDL 2008. IEEE International Conference on
Conference_Location :
Futuroscope-Chasseneuil
Print_ISBN :
978-1-4244-1585-4
Electronic_ISBN :
978-1-4244-1586-1
DOI :
10.1109/ICDL.2008.4622495