DocumentCode
2808696
Title
The develpoment and application of low Dk material
Author
Liang, Peter
Author_Institution
Nan Ya Plastic Corp., South Yarmouth
fYear
2007
fDate
1-3 Oct. 2007
Firstpage
363
Lastpage
368
Abstract
The trends for electronics products are toward smaller size, lighter weights, higher speeds and higher frequency applications. Standard FR4 material faces an extreme limit for these applications, especially in regard to Dk, Df and reliability. Decreasing the Dk of the laminate will increase operating speeds of processing (i.e. Pentium processor, Rambus and future processor. The low Dk material can also provide a wider working window in the production process for narrow line PCB. Normal FR4 material can´t meet the requirement of high speed circuit design. In order to reduce Dk value from 4.6 to 3.8, Nan Ya try to develop new resin system and combine with low Dk glass cloth. Our goal is to develop low Dk with low cost material.
Keywords
electronic products; glass; laminates; high speed circuit design; low Dk glass cloth; low Dk material; Absorption; Costs; Frequency; Glass; Laminates; Materials reliability; Moisture; Propagation losses; Resins; Telecommunication network reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International
Conference_Location
Taipei
Print_ISBN
978-1-4244-1636-3
Electronic_ISBN
978-1-4244-1637-0
Type
conf
DOI
10.1109/IMPACT.2007.4433637
Filename
4433637
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