• DocumentCode
    2808696
  • Title

    The develpoment and application of low Dk material

  • Author

    Liang, Peter

  • Author_Institution
    Nan Ya Plastic Corp., South Yarmouth
  • fYear
    2007
  • fDate
    1-3 Oct. 2007
  • Firstpage
    363
  • Lastpage
    368
  • Abstract
    The trends for electronics products are toward smaller size, lighter weights, higher speeds and higher frequency applications. Standard FR4 material faces an extreme limit for these applications, especially in regard to Dk, Df and reliability. Decreasing the Dk of the laminate will increase operating speeds of processing (i.e. Pentium processor, Rambus and future processor. The low Dk material can also provide a wider working window in the production process for narrow line PCB. Normal FR4 material can´t meet the requirement of high speed circuit design. In order to reduce Dk value from 4.6 to 3.8, Nan Ya try to develop new resin system and combine with low Dk glass cloth. Our goal is to develop low Dk with low cost material.
  • Keywords
    electronic products; glass; laminates; high speed circuit design; low Dk glass cloth; low Dk material; Absorption; Costs; Frequency; Glass; Laminates; Materials reliability; Moisture; Propagation losses; Resins; Telecommunication network reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-1636-3
  • Electronic_ISBN
    978-1-4244-1637-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2007.4433637
  • Filename
    4433637