• DocumentCode
    2808751
  • Title

    A novel green technology for the plated through hole process

  • Author

    Retallick, R. ; Ying Ding

  • Author_Institution
    MacDermid Inc., Waterbury
  • fYear
    2007
  • fDate
    1-3 Oct. 2007
  • Firstpage
    381
  • Lastpage
    384
  • Abstract
    Electroless copper has long been the dominate process for plated through hole (PTH) metallization. The technology is widely used by printed circuit board fabricators and driven by a long standing acceptance by OEMs. However, this established technology has many drawbacks that have a direct impact on our environment. Namely, it contains a known carcinogen, consumes a lot of water and is inherently unstable leading to increased demands on waste treatment operations. Through the years there has been significant work done in this area of the manufacturing process to overcome the challenges associated with electroless copper technologies. The ultimate goal being an environmentally friendly PTH process that maintains well established performance and reliability standards. In recent years, we have developed and perfected a carbon-based direct plate PTH technology that successfully eliminates the use of hazardous chemicals, drastically reduces water consumption, and decreases the burden on industrial wastewater treatment systems. This innovative technology offers the same performance as electroless copper with the added benefits of less cost, less space, reduced labor requirements and a better working environment for the operators. Our efforts on improving conductivity, copper cleaning and product reliability have yielded an incredible process for the manufacture of printed circuit boards.
  • Keywords
    copper; integrated circuit reliability; manufacturing processes; printed circuit manufacture; conductivity; copper cleaning; electroless copper; green technology; manufacturing process; metallization; plated through hole process; printed circuit board manufacture; product reliability; Chemical hazards; Chemical industry; Chemical technology; Copper; Maintenance; Manufacturing processes; Metallization; Printed circuits; Space technology; Wastewater treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-1636-3
  • Type

    conf

  • DOI
    10.1109/IMPACT.2007.4433641
  • Filename
    4433641