Title :
The design of a knowledge-based system for electronic package design
Author :
Aakalu, N. ; Barnes, J. ; Beard, R. ; Christiansen, G. ; Iskander, M. ; Kamerath, E. ; Vuu, L.
Author_Institution :
Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
Abstract :
The development of an integrated CAD (computer-aided design) resource of design tools and databases which provides a valuable tool in the design of electronic packages is described. Results of various test cases are presented and used to evaluate the performance of the developed knowledge-based system and identify areas of needed improvements. The following issues which are important in electronic package design are discussed: electrical characterization, mechanical stress, thermal distribution, and wireability analysis.<>
Keywords :
circuit CAD; knowledge based systems; stress analysis; thermal analysis; computer-aided design; databases; design tools; electrical characterization; electronic package design; knowledge-based system; mechanical stress; test cases; thermal distribution; wireability analysis; Databases; Design automation; Design engineering; Electronic packaging thermal management; Electronics packaging; Expert systems; Integrated circuit packaging; Knowledge based systems; Software packages; Thermal stresses;
Conference_Titel :
Antennas and Propagation Society International Symposium, 1991. AP-S. Digest
Conference_Location :
London, Ontario, Canada
Print_ISBN :
0-7803-0144-7
DOI :
10.1109/APS.1991.174879
