DocumentCode :
2809184
Title :
Improved performance of polyhedral oligomeric silsesquioxane epoxies
Author :
Horwath, J. ; Schweickart, D. ; Garcia, Gaetan ; Klosterman, D. ; Galaska, M.
Author_Institution :
Wright-Patterson Air Force Base, Fairborn, OH, USA
fYear :
2005
fDate :
16-19 Oct. 2005
Firstpage :
155
Lastpage :
157
Abstract :
In high voltage applications, polymer insulation can be exposed to very high electrical field stress, resulting in long term exposure to corona. The electrical field stress may be much below dielectric breakdown threshold. Eventually the exposure to corona can lead to failure of the high voltage component. Nanometer sized inorganic fillers are increasingly used as reinforcing materials for mechanical or thermal property improvement of polymers. Improvements in mechanical modulus or heat deflection temperature are often realized. These fillers may also improve some electrical properties such as corona endurance in polymers. In the current study, polyhedral oligomeric silsesquioxane (POSS) loaded epoxies were produced and tested for corona endurance. Results suggest a five times improvement in ac corona lifetime of selected POSS-epoxies compared to unloaded epoxy.
Keywords :
corona; electric breakdown; epoxy insulation; high-voltage techniques; nanostructured materials; polymers; corona; dielectric breakdown threshold; electrical field stress; electrical property; heat deflection temperature; high voltage application; mechanical modulus; mechanical property; nanometer sized inorganic filler; polyhedral oligomeric silsesquioxane epoxies; polymer insulation; reinforcing material; thermal property; Corona; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Inorganic materials; Lead; Plastic insulation; Polymers; Thermal stresses; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2005. CEIDP '05. 2005 Annual Report Conference on
Print_ISBN :
0-7803-9257-4
Type :
conf
DOI :
10.1109/CEIDP.2005.1560644
Filename :
1560644
Link To Document :
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