• DocumentCode
    2809184
  • Title

    Improved performance of polyhedral oligomeric silsesquioxane epoxies

  • Author

    Horwath, J. ; Schweickart, D. ; Garcia, Gaetan ; Klosterman, D. ; Galaska, M.

  • Author_Institution
    Wright-Patterson Air Force Base, Fairborn, OH, USA
  • fYear
    2005
  • fDate
    16-19 Oct. 2005
  • Firstpage
    155
  • Lastpage
    157
  • Abstract
    In high voltage applications, polymer insulation can be exposed to very high electrical field stress, resulting in long term exposure to corona. The electrical field stress may be much below dielectric breakdown threshold. Eventually the exposure to corona can lead to failure of the high voltage component. Nanometer sized inorganic fillers are increasingly used as reinforcing materials for mechanical or thermal property improvement of polymers. Improvements in mechanical modulus or heat deflection temperature are often realized. These fillers may also improve some electrical properties such as corona endurance in polymers. In the current study, polyhedral oligomeric silsesquioxane (POSS) loaded epoxies were produced and tested for corona endurance. Results suggest a five times improvement in ac corona lifetime of selected POSS-epoxies compared to unloaded epoxy.
  • Keywords
    corona; electric breakdown; epoxy insulation; high-voltage techniques; nanostructured materials; polymers; corona; dielectric breakdown threshold; electrical field stress; electrical property; heat deflection temperature; high voltage application; mechanical modulus; mechanical property; nanometer sized inorganic filler; polyhedral oligomeric silsesquioxane epoxies; polymer insulation; reinforcing material; thermal property; Corona; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Inorganic materials; Lead; Plastic insulation; Polymers; Thermal stresses; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2005. CEIDP '05. 2005 Annual Report Conference on
  • Print_ISBN
    0-7803-9257-4
  • Type

    conf

  • DOI
    10.1109/CEIDP.2005.1560644
  • Filename
    1560644