DocumentCode :
2809285
Title :
The influence of physical and chemical linkage on the properties of nanocomposites
Author :
Roy, M. ; Nelson, J.K. ; Schadler, Linda S. ; Zou, C. ; Fothergill, J.C.
Author_Institution :
Leicester Univ., UK
fYear :
2005
fDate :
16-19 Oct. 2005
Firstpage :
183
Lastpage :
186
Abstract :
It has been shown by several groups that the mechanical and electrical behavior of composites changes quite substantially, and often beneficially, when the filler particle size is less than 100 nm in diameter. There is also good reason to believe that the interface between the embedded particulates and the polymer matrix holds the key to understanding the bulk phenomena observed. Materials based on an SiO2-polyolefin system have been formulated with functionalized particulates so as to affect the physical and chemical linkages. The agents used to achieve this include amino-silane, hexamethyl-disilazane and triethoxyvinylsilane. The emerging picture of the interface is supported by detailed dielectric spectroscopy and internal space charge assessment. The nature of the internal structure has been related to the bulk properties observed such as the breakdown strength, voltage endurance, and the measurement of internal charges resulting from interfacial polarization.
Keywords :
electric breakdown; nanocomposites; organic-inorganic hybrid materials; particle size; polarisation; space charge; SiO2-polyolefin system; amino-silane; breakdown strength; charge measurement; chemical linkage; dielectric spectroscopy; electrical behavior; embedded particulate; filler particle size; hexamethyl-disilazane; interface phenomena; interfacial polarization; mechanical behavior; nanocomposite; physical linkage; polymer matrix; space charge assessment; triethoxyvinylsilane; voltage endurance; Breakdown voltage; Chemicals; Couplings; Current measurement; Dielectric materials; Dielectric measurements; Electrochemical impedance spectroscopy; Nanocomposites; Polymers; Space charge;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2005. CEIDP '05. 2005 Annual Report Conference on
Print_ISBN :
0-7803-9257-4
Type :
conf
DOI :
10.1109/CEIDP.2005.1560651
Filename :
1560651
Link To Document :
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