DocumentCode
2810011
Title
Influence of cold arm thickness on mechanical property of U-shaped polycrystalline silicon microelectrothermal actuator
Author
Tian, Zhongke
Author_Institution
Dept. of Electromech. Eng., Qingdao Univ. of Sci. & Technol., Qingdao, China
fYear
2011
fDate
15-17 July 2011
Firstpage
4119
Lastpage
4121
Abstract
A new method which just increases cold arm thickness of U-shaped polycrystalline silicon microelectrothermal actuator was proposed to efficiently amplify normal contact force caused by a rigid object placed away from the free end of the actuator. Finite element simulation results demonstrated that this method is better than the actuator array approach to amplify the normal contact force. As far as manufacturing difficulty and material consumption are concerned, the presented method is also more competitive than the array pattern. Considering amplifying effect on normal contact force, maximum equivalent stress on hot arm and equivalent stress at juncture of hot arm and cold arm, an actuator with hot arm thickness 2 μm and cold arm thickness about 7 μm is the relatively optimal configuration.
Keywords
elemental semiconductors; finite element analysis; mechanical contact; microactuators; silicon; Si; U-shaped polycrystalline silicon microelectrothermal actuator; array pattern; cold arm thickness; finite element simulation; hot arm thickness; maximum equivalent stress; mechanical property; normal contact force; size 2 mum; size 7 mum; Actuators; Arrays; Force; Micromechanical devices; Silicon; Software; Stress; FE-simulation; arm thickness; mechanical property; microelectrothermal actuator; polycrystalline silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechanic Automation and Control Engineering (MACE), 2011 Second International Conference on
Conference_Location
Hohhot
Print_ISBN
978-1-4244-9436-1
Type
conf
DOI
10.1109/MACE.2011.5987909
Filename
5987909
Link To Document